This professional real‑time temperature‑sensing flexible pad is built for mobile‑phone motherboard fault‑point positioning and heating‑process temperature monitoring, boosting repair diagnostic efficiency🛠️
✨ Key Features:
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Real‑time Rapid Response & Accurate Temperature Measurement: 🌡️ Real‑time color‑change feedback, fast thermal reaction for precise temperature capture at 35℃ and above.
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High‑temperature Resistant Reusable Flexible Material: 🔥 Heat‑resistant soft foldable substrate, supports repeated use without performance attenuation.
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Precise Visual Fault‑point Positioning: 🎯 Intuitive color‑shift marks over‑heating zones to quickly locate short‑circuit or damaged motherboard components.
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Simple & Convenient Operation: 🖐️ Lightweight bendable sheet, lays flat on mainboards for instant thermal inspection with zero complex setup.
📐 Product Parameters
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Brand: MR.YANG (M.Y)
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Model: S‑03
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Dimensions: 108*64mm
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Net Weight: 4.5g
🛒 Get Yours Today! Click "Add to Cart" now to equip your workshop with S‑03!