This professional chip repair‑specialized cleaning tool is built for removing stubborn underfill black glue from CPU, hard disk and BGA IC chips, effectively cutting repair failure risk for mobile‑phone rework🛠️
✨ Key Features:
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Replaceable Flexible PI‑material Blade: 🛡️ Detachable blade design with soft PI substrate cleans black glue without scratching IC chips or lifting PCB pads.
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Ultra‑thin Blade for Pad Protection: ✂️ Slim edge easily slides under chips to strip residual glue; eliminates circuit‑scratching and pad‑lifting risks versus metal blades.
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Heat‑responsive Softening Performance: 🌡️ Blade material softens under heat for boosted flexibility, fits uneven surfaces tightly for thorough glue removal.
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Wide‑model Compatibility & High‑temp Resistance: 📱 Works for CPU, hard disk and mainstream BGA chips; heat‑resistant material stays non‑deformed under repair heating.
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Anti‑slip Ergonomic Metal Handle: 🖐️ Multi‑color electroplated non‑slip grip delivers stable control for long‑time precise repair operations.
📐 Product Parameters
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Brand: MIJING
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Model: SP1
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Tool Size: 158*13mm
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Package Size: 200*55mm
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Net Weight: 24.5g
🛒 Get Yours Today! Click "Add to Cart" now to equip your workshop with SP1!